In this episode of the Semiconductor Insiders video series, Dan is joined by Anna Fontanelli, founder and CEO of MZ Technologies. Anna explains some of the substantial challenges associated with heterogeneous 3D integration. Dan then begins to explore some of the capabilities of GenioEVO, the first integrated chiplet/package… Read More…

Dan is joined by Michele Sartori – senior product manager at PQShield. Michele is a software engineer in Computer and Network Security, specializing in product management. He is a passionate tech team leader at the forefront of emerging technologies focused on achieving tangible results. In this highly informative discussion,… Read More…

Dan is joined by Kevin O’Buckley, senior vice president and general manager of Foundry Services at Intel Corporation. In this role, he is responsible for driving continued growth for Intel Foundry and its differentiated systems foundry offerings, which go beyond traditional wafer fabrication to include packaging, chiplet… Read More…

Dan is joined by Matthew Ozalas, a distinguished RF engineer at Keysight Technologies. With extensive experience in RF and microwave engineering, Matthew has made significant contributions to the field, particularly in the design and development of RF power amplifiers. His expertise spans hardware and software applications… Read More…

Dan is joined by Marc Evans, director of business development and technology at Andes. Marc has over twenty years of experience in the use of CPU, DSP, and Specialized IP in SoCs from his prior positions at Lattice Semiconductor, Ceva, and Tensilica. During his early career, Marc was a processor architect, making significant contributions… Read Mor…