Europe’s chip future is being built in real time, and the view from Munich is electric. We sit down with IMEC’s leadership and ESMC’s founding CEO to unpack how pilot lines, a major Dresden fab, and the EU Chips Act are reshaping the continent’s strategy—from research to high-volume manufacturing. Along the way, we track the evolution of Semicon Europa over 50 years, from a supplier-centric expo to a convening force that brings equipment makers, materials leaders, device companies, and end users into one space.
Our guests open the hood on what resilience actually looks like: a 28 nm to 12 nm FinFET roadmap with integrated RRAM for microcontrollers, a half‑million‑wafers‑per‑year target, and a hiring plan that scales with purpose-built training in Dresden and Taiwan. On the R&D front, IMEC’s expanded pilot line infrastructure—fueled by multi‑billion‑euro investment—helps Europe retain technology leadership while translating breakthroughs into products. We also examine advanced packaging, where 3D integration and chiplet architectures blur the line between front end and back end and create fresh opportunities for automotive and industrial electronics.
The conversation gets candid on sovereignty versus interdependence. Full autarky is a myth; durable relevance comes from global collaboration, reverse dependencies, and focus on areas where Europe is indispensable—lithography, metrology, materials, and increasingly packaging and system design. We talk talent, too: why workforce visibility, skills pipelines, and on-the-job training will determine whether ambitious ramps hit their marks. If you care about semiconductors, policy, and the future of manufacturing in Europe, this is your inside track.
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