In this episode of the Semiconductor Insiders video series, Dan is once again joined by Anna Fontanelli, founder and CEO of MZ Technologies. In this discussion, more details of the challenges presented by advanced packaging and multi-die design are explored. Anna provides details of what’s involved in architectural … Read More…

Dan is joined by GP Singh, CEO of Ambient Scientific. With over 20 years of experience, GP has played a pivotal role in shaping the industry, driving 50+ chip tapeouts, including game-changing advancements at FinFET technology nodes. Now, as the CEO of Ambient Scientific, GP brings together hands-on engineering expertise and… Read More…

In this episode of the Semiconductor Insiders video series, Dan is joined by Anna Fontanelli, founder and CEO of MZ Technologies. Anna explains some of the substantial challenges associated with heterogeneous 3D integration. Dan then begins to explore some of the capabilities of GenioEVO, the first integrated chiplet/package… Read More…

Dan is joined by Michele Sartori – senior product manager at PQShield. Michele is a software engineer in Computer and Network Security, specializing in product management. He is a passionate tech team leader at the forefront of emerging technologies focused on achieving tangible results. In this highly informative discussion,… Read More…

Dan is joined by Kevin O’Buckley, senior vice president and general manager of Foundry Services at Intel Corporation. In this role, he is responsible for driving continued growth for Intel Foundry and its differentiated systems foundry offerings, which go beyond traditional wafer fabrication to include packaging, chiplet… Read More…