Manage episode 446637730 series 2935206
Recorded live at the IMAPS Symposium 2024 in Boston MA, where 3D InCites member companies presented their latest technologies and showcased their products. This episode features conversations with nine of our member companies.
Brendan Wells, Amkor Technology, Inc., explains the difference between laminate and strip-based substrates for advanced packaging and when to use each. He also discusses how chiplet integration is impacting the assembly processes.
Evan Griffith and Sze Pe Lim, Indium Corporation, talk about how changing advanced packaging requirements for AI chip sets are changing the game for materials development.
John Lannon, general manager of Micross AIT talks about progress with the company’s 300mm capacity expansion and what it means to win the William T. Ashman and John A. Wagnon Technical Achievement Award.
LPKF’s Richard Noack talks about the difference between glass interposers and glass core technology, and what’s driving development of these materials.
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IMAPS is the largest society dedicated to microelectronics and electronics packaging advancement.
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Chapters
1. Peter Cronin, MRSI Systems (00:00:00)
2. Brendan Wells, Amkor Technologies, Inc. (00:01:04)
3. Evan Griffith and Sze Pe Lim, Indium Corporation (00:11:00)
4. John Lannon, Micross AIT (00:19:05)
5. [Ad] Real Talk About Marketing (00:21:44)
6. (Cont.) John Lannon, Micross AIT (00:22:34)
7. Richard Noack, LPKF Laser & Electronics (00:26:51)
8. [Ad] Digital Disruption with Geoff Nielson (00:30:06)
9. (Cont.) Richard Noack, LPKF Laser & Electronics (00:30:49)
10. Sally Ann Henry, ACM Research (00:36:44)
11. Casey Krawiec, StratEdge Corporation (00:41:59)
12. [Ad] Inspiring Tech Leaders - The Technology Podcast (00:42:19)
13. (Cont.) Casey Krawiec, StratEdge Corporation (00:42:57)
14. Habib Hichri, Ajinomoto Fine Techno (00:49:57)
15. Guilian Gao, Adeia (00:58:42)
16. Scott Sikorski, IBM (01:12:47)
170 episodes