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In this episode of our podcast, “Reinventing Semiconductor Packaging: AI, Physics and Geometry in Action,” we explore how cutting-edge technologies are transforming the way chips are built. From leveraging AI for smarter designs to applying physics and geometry for precision, discover the innovations shaping next-generation semiconductor packaging.
#Semiconductors #ChipDesign #TechInnovation #Electronics #AIinSemiconductors #AdvancedPackaging #GeometryInAction #PhysicsDrivenDesign #FutureOfTech #EngineeringExcellence #SmartManufacturing #NextGenChips

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Chapters

1. Setting The Stage: AI And Packaging (00:00:00)

2. Guests And Mission Introduced (00:01:45)

3. Industry Pressures And Core Challenges (00:02:56)

4. Heat, Warpage, And Reliability Risks (00:03:57)

5. Unifying AI, Physics, And Geometry (00:04:46)

6. Teaching AI Real Physics At Scale (00:07:46)

7. From ECAD Files To Instant Thermal Fields (00:10:43)

8. Validations, Speedups, And Designer Workflow (00:12:03)

9. Privacy, Synthetic Data, And Secure Deploys (00:13:14)

10. Guaranteed Accuracy And Post-Processing (00:15:41)

11. One Foundation Model Per Physics (00:18:08)

12. Investor Lens: Market And Team (00:19:02)

13. Beyond Design: Digital Twins And Yield (00:21:09)

14. Agentic Workflows For Hardware (00:23:00)

15. Trends: AI-Native Co-Design Futures (00:25:02)

16. Digital Twins For Predictive Reliability (00:27:06)

17. Adoption Playbook And Building Trust (00:28:46)

18. Breakthroughs: Chiplets And Standards (00:31:06)

19. Closing Thoughts And Next Steps (00:39:50)

34 episodes