We are currently experiencing a significant turning point in the semiconductor industry, marked by the rapid adoption of heterogeneous integration of dies into a single package. This new architecture presents unique challenges and demands. However, one thing is certain: the industry needs an interconnect that quickly and reliably links the dies. The Universal Chiplet Interconnect Express (UCIe) has emerged as the leading standard for die-to-die connectivity due to its flexibility, comprehensive stack support, and technical strengths. This podcast delves into the UCIe standard, describing the challenges it helps designers tackle, some of the progress since its inception, and ways to maximize UCIe beyond the standard’s definition. We will also explain how to best utilize UCIe to cater to your specific application needs.