Interview With Nitesh Satheesh, Senior Technical Staff Engineer at Microchip Technology Inc.

Nitesh Satheesh, Senior Technical Staff Engineer at Microchip Technology, explores the role of power packaging in shaping the design and performance of power modules used across industries, including automotive, aerospace, and industrial systems.

Nitesh highlights key aspects of power packaging, including thermal management, parasitic effects, integration, and compliance with industry standards, and stresses how these issues are often underestimated until they become design challenges.

The discussion highlights the risks engineers face when power packaging is overlooked early in development, leading to inefficiencies and thermal problems. Nitesh notes that power modules streamline the process for customers, enabling them to focus on their core expertise while Microchip addresses the complexities of packaging.

He also discusses the importance of module construction and the need to balance design innovation with manufacturability to ensure practical, reliable solutions. Finally, Nitesh advises engineers to design for realistic, intermediate use cases rather than extreme worst-case scenarios, which often result in over-engineering and unnecessary cost.

Find out more about Microchip’s power packaging solutions here: https://www.microchip.com/en-us/products/power-management/silicon-carbide-sic-devices-and-power-modules

Time Stamps

[00:27] - Guest Introduction: Nitesh Satheesh

[01:56] - Importance of Power Packaging

[06:18] - Customer Needs and Power Modules

[08:50] - Benefits of Using Bare Die in Modules

[10:19] - Trade-offs in Module Design

[13:22] - Design vs. Manufacturing: The Secret Sauce

[14:18] - Future Trends in Power Module Design

[16:51] - Key Takeaway for Engineers

[17:48] - Staying Updated with Microchip

Follow Nitesh Satheesh

Nitesh Satheesh on LinkedIn: https://www.linkedin.com/in/nitesh-satheesh/

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